Qualcomm SD212

CPE Details

Qualcomm SD212
qualcomm
sd212
-
2019-11-26
18h04 +00:00
2019-11-26
18h04 +00:00
CPE NVD
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CPE Name: cpe:2.3:h:qualcomm:sd212:-:*:*:*:*:*:*:*

Informations

Vendor

qualcomm

Product

sd212

Version

-

Related CVE

Open and find in CVE List

CVE ID Publié Description Score Gravité
CVE-2023-28575 2023-08-08 09h15 +00:00 The cam_get_device_priv function does not check the type of handle being returned (device/session/link). This would lead to invalid type usage if a wrong handle is passed to it.
7.8
Haute
CVE-2017-18282 2018-10-23 11h00 +00:00 Non-secure SW can cause SDCC to generate secure bus accesses, which may expose RPM access in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660.
7.8
Haute
CVE-2017-18280 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MDM9607, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDM429, SDM439, SDM632, Snapdragon_High_Med_2016, when a Trusted Application has opened the SPI/I2C interface to a particular device, it is possible for another Trusted Application to read the data on this open interface by calling the SPI/I2C read function.
7.8
Haute
CVE-2017-18314 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
9.8
Critique
CVE-2018-11267 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
7.8
Haute
CVE-2018-11268 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
7.8
Haute
CVE-2018-11269 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
7.8
Haute
CVE-2018-11277 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
7.8
Haute
CVE-2018-11285 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur.
7.8
Haute
CVE-2018-11287 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, incorrect control flow implementation in Video while checking buffer sufficiency.
9.8
Critique
CVE-2018-11290 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820A, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests is not done properly due to a flawed RNG in use.
7.5
Haute
CVE-2018-11292 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
7.8
Haute
CVE-2018-11982 2018-09-20 11h00 +00:00 In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
8.8
Haute
CVE-2018-5837 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests is not done properly due to a flawed RNG which produced repeating output much earlier than expected.
7.5
Haute
CVE-2018-5871 2018-09-20 11h00 +00:00 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected.
6.5
Moyen
Les informations affichées sur CVE Find proviennent de plusieurs sources de référence rigoureusement sélectionnées. Les données CVE sont fournies par MITRE Corporation et la National Vulnerability Database (NVD). Le catalogue des vulnérabilités activement exploitées (KEV) provient de la Cybersecurity and Infrastructure Security Agency (CISA), tandis que les scores EPSS sont issus de FIRST.org. Enfin, les données relatives aux faiblesses logicielles (CWE) et aux schémas d'attaque courants (CAPEC) sont maintenues par MITRE Corporation, et les informations sur les configurations logicielles et matérielles (CPE) proviennent du NVD.