CPE Details
Qualcomm Snapdragon SC8180X-AC
-
2023-12-16
02h37 +00:00
02h37 +00:00
2023-12-16
02h37 +00:00
02h37 +00:00
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CPE Name: cpe:2.3:h:qualcomm:snapdragon_sc8180x-ac:-:*:*:*:*:*:*:*
Informations
Vendor
qualcommProduct
snapdragon_sc8180x-acVersion
-Related CVE
| CVE ID | Published | Description | Score | Severity |
|---|---|---|---|---|
| Transient DOS while parsing WPA IES, when it is passed with length more than expected size. | 7.5 |
High |
||
| Transient DOS when processing a NULL buffer while parsing WLAN vdev. | 7.5 |
High |
||
| Memory corruption when processing cmd parameters while parsing vdev. | 8.4 |
High |
||
| Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level. | 7.8 |
High |
||
| Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
Medium |
||
| Memory corruption while loading an ELF segment in TEE Kernel. | 8.8 |
High |
||
| Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments. | 7.8 |
High |
||
| Memory corruption in MPP performance while accessing DSM watermark using external memory address. | 7.8 |
High |
||
| Memory Corruption in SPS Application while exporting public key in sorter TA. | 7.8 |
High |
The information presented on CVE Find originates from several carefully selected reference sources. CVE data is provided by MITRE Corporation and the National Vulnerability Database (NVD). The Known Exploited Vulnerabilities (KEV) catalog is sourced from the Cybersecurity and Infrastructure Security Agency (CISA), while EPSS scores come from FIRST.org. Additionally, data regarding software weaknesses (CWE) and common attack patterns (CAPEC) is maintained by MITRE Corporation, and information on hardware and software configurations (CPE) is provided by the NVD.