CPE Details
Qualcomm Snapdragon 860 Mobile Platform
-
2023-09-25
16h56 +00:00
16h56 +00:00
2023-09-25
16h56 +00:00
16h56 +00:00
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CPE Name: cpe:2.3:h:qualcomm:snapdragon_860_mobile_platform:-:*:*:*:*:*:*:*
Informations
Vendor
qualcommProduct
snapdragon_860_mobile_platformVersion
-Related CVE
| CVE ID | Published | Description | Score | Severity |
|---|---|---|---|---|
| Memory corruption when allocating and accessing an entry in an SMEM partition continuously. | 8.4 |
High |
||
| Memory corruption while Configuring the SMR/S2CR register in Bypass mode. | 8.4 |
High |
||
| Transient DOS while handling PS event when Program Service name length offset value is set to 255. | 5.5 |
Medium |
||
| Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table. | 8.4 |
High |
||
| Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus. | 6.2 |
Medium |
||
| Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload. | 7.8 |
High |
||
| Memory corruption in WLAN handler while processing PhyID in Tx status handler. | 7.8 |
High |
||
| Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload. | 7.8 |
High |
The information presented on CVE Find originates from several carefully selected reference sources. CVE data is provided by MITRE Corporation and the National Vulnerability Database (NVD). The Known Exploited Vulnerabilities (KEV) catalog is sourced from the Cybersecurity and Infrastructure Security Agency (CISA), while EPSS scores come from FIRST.org. Additionally, data regarding software weaknesses (CWE) and common attack patterns (CAPEC) is maintained by MITRE Corporation, and information on hardware and software configurations (CPE) is provided by the NVD.