CPE Details
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CPE Name: cpe:2.3:h:qualcomm:md9607:-:*:*:*:*:*:*:*
Informations
Vendor
qualcommProduct
md9607Version
-Related CVE
| CVE ID | Published | Description | Score | Severity |
|---|---|---|---|---|
| During listener modified response processing, a buffer overrun occurs due to lack of buffer size verification when updating message buffer with physical address information in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8917, MSM8953, MSM8996AU, Nicobar, QCM2150, QCS405, QCS605, QM215, Rennell, SA6155P, Saipan, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 7.8 |
High |
The information presented on CVE Find originates from several carefully selected reference sources. CVE data is provided by MITRE Corporation and the National Vulnerability Database (NVD). The Known Exploited Vulnerabilities (KEV) catalog is sourced from the Cybersecurity and Infrastructure Security Agency (CISA), while EPSS scores come from FIRST.org. Additionally, data regarding software weaknesses (CWE) and common attack patterns (CAPEC) is maintained by MITRE Corporation, and information on hardware and software configurations (CPE) is provided by the NVD.