CPE Details
Qualcomm Snapdragon 835 Mobile Platform Firmware
-
2023-04-20
09h34 +00:00
09h34 +00:00
2023-09-02
00h30 +00:00
00h30 +00:00
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CPE Name: cpe:2.3:o:qualcomm:snapdragon_835_mobile_platform_firmware:-:*:*:*:*:*:*:*
Informations
Vendor
qualcommProduct
snapdragon_835_mobile_platform_firmwareVersion
-Related CVE
| CVE ID | Published | Description | Score | Severity |
|---|---|---|---|---|
| Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 8.4 |
High |
||
| Information disclosure due to buffer over-read in Bluetooth Host while A2DP streaming. | 8.2 |
High |
||
| Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |
High |
||
| Memory corruption due to use after free in Modem while modem initialization. | 7.8 |
High |
||
| Information disclosure due to buffer overread in Linux sensors | 6.8 |
Medium |
||
| Memory corruption due to integer overflow to buffer overflow in Modem while parsing Traffic Channel Neighbor List Update message. | 7.8 |
High |
||
| Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
Medium |
The information presented on CVE Find originates from several carefully selected reference sources. CVE data is provided by MITRE Corporation and the National Vulnerability Database (NVD). The Known Exploited Vulnerabilities (KEV) catalog is sourced from the Cybersecurity and Infrastructure Security Agency (CISA), while EPSS scores come from FIRST.org. Additionally, data regarding software weaknesses (CWE) and common attack patterns (CAPEC) is maintained by MITRE Corporation, and information on hardware and software configurations (CPE) is provided by the NVD.