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CPE Name: cpe:2.3:h:qualcomm:zz_qcs605:-:*:*:*:*:*:*:*
Informations
Vendor
qualcommProduct
zz_qcs605Version
-Related CVE
| CVE ID | Published | Description | Score | Severity |
|---|---|---|---|---|
| There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605. | 7.8 |
High |
The information presented on CVE Find originates from several carefully selected reference sources. CVE data is provided by MITRE Corporation and the National Vulnerability Database (NVD). The Known Exploited Vulnerabilities (KEV) catalog is sourced from the Cybersecurity and Infrastructure Security Agency (CISA), while EPSS scores come from FIRST.org. Additionally, data regarding software weaknesses (CWE) and common attack patterns (CAPEC) is maintained by MITRE Corporation, and information on hardware and software configurations (CPE) is provided by the NVD.