CWE-1195
Manufacturing and Life Cycle Management Concerns
Draft
2020-02-24 +00:00
2023-06-29 +00:00
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Name: Manufacturing and Life Cycle Management Concerns
Weaknesses in this category are root-caused to defects that arise in the semiconductor-manufacturing process or during the life cycle and supply chain.
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Vulnerability Mapping Notes
Justification : This entry is a Category. Using categories for mapping has been discouraged since 2019. Categories are informal organizational groupings of weaknesses that can help CWE users with data aggregation, navigation, and browsing. However, they are not weaknesses in themselves.Comment : See member weaknesses of this category.
Submission
| Name | Organization | Date | Date release | Version |
|---|---|---|---|---|
| CWE Content Team | MITRE | 4.0 |
Modifications
| Name | Organization | Date | Comment |
|---|---|---|---|
| CWE Content Team | MITRE | updated Relationships | |
| CWE Content Team | MITRE | updated Relationships | |
| CWE Content Team | MITRE | updated Relationships | |
| CWE Content Team | MITRE | updated Relationships | |
| CWE Content Team | MITRE | updated Mapping_Notes | |
| CWE Content Team | MITRE | updated Mapping_Notes |
The information presented on CVE Find originates from several carefully selected reference sources. CVE data is provided by MITRE Corporation and the National Vulnerability Database (NVD). The Known Exploited Vulnerabilities (KEV) catalog is sourced from the Cybersecurity and Infrastructure Security Agency (CISA), while EPSS scores come from FIRST.org. Additionally, data regarding software weaknesses (CWE) and common attack patterns (CAPEC) is maintained by MITRE Corporation, and information on hardware and software configurations (CPE) is provided by the NVD.